Thank you for your interest in this Webcast. You can easily view it by completing the form below.
The most common method for cooling electronics assemblies is best classified as forced convection cooling. The alternative classifications are natural convection (passive) cooling and radiative cooling (such as used in space-based applications). Forced convection cooling typically involves air being moved through a system by a fan, and the air removes the heat from the system via convection.
This web seminar is the first in a two-part series detailing the simulation of forced convection electronic systems using STAR-CCM+. Best practices for each step in the process will be discussed during the series; Part 1 will address:
Specific examples will be used to visualize and demonstrate the steps.
This seminar is targeted to either looking at or already performing thermal simulations of electronics assemblies.