The most common method for cooling electronics assemblies is best classified as forced convection cooling. The alternative classifications are natural convection (passive) cooling and radiative cooling (such as used in space-based applications). Forced convection cooling typically involves air being moved through a system by a fan with the air removing the heat from the system via convection.
This webcast is the second in a two-part series detailing the simulation of forced convection electronic systems using STAR-CCM+. Best practices for each step in the process are discussed during the series. Part 2 addresses:
Specific examples are used to visualize and demonstrate the steps.
This seminar is targeted to engineers and designers either looking at or already performing thermal simulations of electronics assemblies.
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