June 6, 2013 (This event is available in multiple time zones and will be conducted in English.)
Historically, thermal simulations of electronic systems have utilized dramatically simplified geometric versions of the systems. The simplifications show up in two main ways:
For some assemblies the inaccuracy, due to these simplifications, is still within acceptable levels, but for many modern designs the simplifications would cause unacceptable deviations from reality.
This seminar details techniques for modeling even the most complex geometries in STAR-CCM+. CD-adapco has decades of experience modeling highly detailed, complex assemblies and various tools and techniques in STAR-CCM+ allow the thermal analyst to include all the detail needed for an accurate simulation.