Thank you for your interest in our upcoming free workshop! Please register by completing the simple form to the right.
This seminar will present the most up-to-date 3D analysis and efficient heat transfer methods available for mechanical and electronic system design, including components and assemblies.
Thermal simulation specialists will present examples of detailed 3D calculations for predicting the temperatures of electronic systems such as servers, avionics chassis, telecommunications equipment, consumer devices, and lighting systems. Cooling approaches addressed will include forced air convection, natural (passive) convection, and liquid cooling.
Additionally, the discussion will explore advanced heat transfer techniques such as phase change materials, boiling heat transfer, thermoelectric devices, and heat pipes. Finally, effective interpretation of simulation results will be demonstrated with the goal of efficiently guiding design changes to achieve an optimal thermal design.
As an attendee, you will receive firsthand knowledge of how companies apply design-time settings for the simulation of heat transfer in forced convection, conduction, and thermal and solar radiation scenarios.
This workshop is free, but registration is required. Sign up today!
|9:00 AM - 9:30 AM||Registration and Coffee|
|9:30 AM - 9:45 AM||Welcome and Introductions|
|9:45 AM - 11:00 AM||CD-adapco Company Presentation:
Overview prediction of heat transfer through 3D simulation.
Applications to heat exchangers, air conditioning and cooling of electronics
|11:00 AM - 11:20 AM||Coffee Break|
|11:20 AM - 12:30 PM||STAR-CCM+ Software Live Demonstration|
|12:30 PM - 2:00 PM||Lunch|
This event is free, but registration is required. Please complete the provided form to sign up.