Automated solution of the inverse problem in electronics cooling
Pick a time to fit your schedule:
February 14, 2017
There is no charge to attend, but registration is required.
The majority of engineering simulations involve a known geometry, prescribed conditions and computation of the predicted results. However, the design question is often posed as the inverse: I have a desired result and need to know what conditions or what geometry will produce that result.
For an electronics cooling situation, the inverse problem description might be that you have a targeted maximum temperature for the components and you need to determine what geometry will produce this for a given set of conditions, or alternatively, what are the maximum heat dissipations allowed for a given geometry.
This web seminar will demonstrate how both ways of posing the inverse electronics cooling problem can be automatically solved using simulation software. A method using the design exploration capabilities will address the variable geometry approach, while a method using field functions will be used to demonstrate the variable conditions situation.
These techniques will further equip the design engineer in using simulation to design better products, faster.